Definitive recommendation for bonding Broadcom NICS?

Hans-Peter Zahno hans-peter.zahno at
Thu Oct 14 02:18:00 CDT 2004


I confirm using bonding on RHEL3 with dkms/bcm5700, e100 in active-backup 
failover mode on our PE2550.
But I'm really not sure which driver to better use, tg3 or bcm5700? I didn't 
run any stress tests at all. What are the recommendations from Dell?


Am Donnerstag, 14. Oktober 2004 08:27 schrieben Sie:
> Kevin M. Myer wrote:
> > Hello,
> >
> > I have a rack of 2650's that I want to use a NIC bonding driver with
> > (failover and loadbalance mode).  I'm finding it extremely cumbersome to
> > have to recompile the bcm5700 and basp drivers for every kernel upgrade.
> You should use dkms packages for bcm5700 and basp to solve this issue. I
> thought Dell's CDs shipped with dkms packages for bcm5700 and basp for
> RHEL3 - I also have such packages for RHEL2.1 (where you have no choice
> since the bonding module isnot present) ...
> >  And with RHEL
> > 3, Update 3, I find I have to restart the network after initial boot for
> > the default route to get set properly.  But I'm also seeing posts from
> > folks that tg3 doesn't handle well under high loads so using that and the
> > bonding driver thats include with Red Hat EL might not work either.
> The bonding driver in RHEL3 does work, and there's nothing preventing
> you from using the bonding driver with bcm5700 ...
> > What is the definitive recommendation for a bonding driver for Broadcom
> > NICS? Or isn't there one?
> Since I don't admin such machines ... I'll let the others answer.
> Regards,
> Buchan

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